LG Innotek Unveils Industry-First Copper Post Technology for Thinner, High-Performance Smartphones
July 7, 2025
LG Innotek has announced the successful development and mass production of the world’s first Copper Post (Cu-Post) semiconductor substrate technology designed for mobile devices, marking a significant advancement in the ongoing race to make smartphones thinner and more powerful.
With global smartphone manufacturers under constant pressure to reduce device size while boosting performance, the need for ultra-compact, high-efficiency components has never been greater. LG Innotek’s new Cu-Post technology is poised to meet this demand, particularly in high-value applications like Radio Frequency-System in Package (RF-SiP) semiconductor substrates.
Redefining Semiconductor Substrate Design
Developed since 2021, the Cu-Post technology replaces conventional solder ball configurations by mounting smaller solder balls onto elevated copper posts attached to the semiconductor substrate. This structural shift enables denser solder ball layouts, reduces overall component size, and significantly improves thermal performance.
Traditionally, solder balls are mounted directly onto substrates, requiring larger spacing to avoid thermal fusing during soldering. This limited the number of circuits that could be implemented, constraining performance gains. LG Innotek’s innovation allows for nearly 20% more solder balls in the same area, enabling a higher circuit count and greater miniaturization.
“This copper post technology will enable LG Innotek to solidify its leadership in the global RF-SiP substrate market,” a company spokesperson said.
Performance, Size, and Heat Management in One Innovation
The new Cu-Post substrates are especially suited for AI-enabled smartphones, where high-speed processing of complex signals requires robust circuitry. With copper offering seven times the thermal conductivity of traditional solder, the Cu-Post structure not only increases circuit density but also enhances heat dissipation. This reduces the risk of signal loss and performance throttling caused by overheating.
Using 3D digital twin simulations, LG Innotek accelerated product development and optimized design precision, ensuring reliability under real-world operating conditions.
Transforming the Industry Standard
With around 40 patents secured for the Cu-Post technology, LG Innotek plans to expand its use beyond RF-SiP into Flip Chip-Chip Scale Packages (FC-CSP) and FC-BGA substrates. The innovation is expected to reshape the semiconductor substrate industry and provide critical support to customers striving for performance and efficiency in mobile and automotive electronics.
“Our copper post technology goes beyond delivering components—it’s about enabling customer success,” said Moon Hyuksoo, CEO of LG Innotek. “We are pioneering a new paradigm in the substrate industry, delivering value through innovation.”
Growth Strategy and Market Vision
Looking ahead, LG Innotek aims to grow its semiconductor component business by focusing on high-value substrate products and vehicle AP modules, targeting $2.2 billion in annual revenue by 2030.
As thinner, faster, and more intelligent devices become the norm, LG Innotek’s Cu-Post technology positions the company at the forefront of next-generation mobile hardware innovation.
